Patent Assignment
Reel/Frame 052590/0291
Assignment of Assignor's Interest
Recorded: 2020-05-06
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2020-04-06
LIU, JEN-FU
Executed: 2020-04-08
TSENG, MING HUNG
Executed: 2020-04-06
CHIANG, TSUNG-HSIEN
Executed: 2020-04-08
LIN, YEN-LIANG
Executed: 2020-04-01
HUANG, TZU-SUNG
Executed: 2020-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method