Patent Assignment
Reel/Frame 052601/0034
Assignment of Assignor's Interest
Recorded: 2020-05-07
Pages: 3
Assignors
LEE, NING-CHENG
Executed: 2020-03-24
KRESGE, LEE C
Executed: 2020-03-24
ZITO, ELAINA J
Executed: 2020-03-24
Assignee
INDIUM CORPORATION
111 BUSINESS PARK DRIVE, UTICA, NEW YORK, 13502
Covered Property
(1)
Preventing Post Reflow Interconnect Failures in Vippo Solder Joints via Utilization of Adhesive Material