Patent Assignment
Reel/Frame 052606/0939
Assignment of Assignor's Interest
Recorded: 2020-05-08
Pages: 5
Assignors
HSUEH, HSIU-WEN
Executed: 2020-04-21
CHEN, CHII-PING
Executed: 2020-04-21
YANG, NENG-JYE
Executed: 2020-04-21
LEE, YA-LIEN
Executed: 2020-04-21
FU, AN-JIAO
Executed: 2020-04-21
TSENG, YA-CHING
Executed: 2020-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Diffusion Barrier Layer for Conductive via to Decrease Contact Resistance