Patent Assignment
Reel/Frame 052621/0214
Assignment of Assignor's Interest
Recorded: 2020-05-11
Pages: 7
Assignors
YOON, HYUNCHUL
Executed: 2020-03-31
KWAK, MINCHEOL
Executed: 2020-03-31
KIM, JOONGHEE
Executed: 2020-03-31
KIM, JIHEE
Executed: 2020-03-31
PARK, YEONGSHIN
Executed: 2020-03-31
HWANG, JUNGHEUN
Executed: 2020-03-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Integrated Circuit Device