Patent Assignment
Reel/Frame 052621/0342
Assignment of Assignor's Interest
Recorded: 2020-05-11
Pages: 8
Assignors
LEE, SANG HO
Executed: 2020-03-12
KIM, EUN A
Executed: 2020-03-25
LEE, KI SEOK
Executed: 2020-03-25
CHOI, JAY-BOK
Executed: 2020-03-26
KIM, KEUN NAM
Executed: 2020-03-15
AHN, YONG SEOK
Executed: 2020-03-12
CHUN, JIN-HWAN
Executed: 2020-04-21
HAN, SANG YEON
Executed: 2020-03-25
HAN, SUNG HEE
Executed: 2020-03-25
HAN, SEUNG UK
Executed: 2020-03-12
HWANG, YOO SANG
Executed: 2020-03-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same