Patent Assignment
Reel/Frame 052629/0916
Assignment of Assignor's Interest
Recorded: 2020-05-11
Pages: 3
Assignors
SATOH, TAKUYA
Executed: 2020-05-07
MATSUMOTO, YUHSUKE
Executed: 2020-05-10
TSUCHIDA, HIROYASU
Executed: 2020-05-11
TAKEI, KOUJI
Executed: 2020-05-11
Assignee
WESTERN DIGITAL TECHNOLOGIES, INC.
5601 GREAT OAKS PARKWAY, SAN JOSE, CALIFORNIA, 95119
Covered Property
(1)
Solder Bump Height Stabilization for Micro and Fine Pitch Electrode Pads
Patent:
11,062,731 →
Application:
16/872,222 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Sep 29, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 053926/0446 →
Release of Security Interest at Reel 053926 Frame 0446
Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058966/0321 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →