Patent Assignment
Reel/Frame 052635/0271
Assignment of Assignor's Interest
Recorded: 2020-05-12
Pages: 6
Assignors
LEE, SHLE-GE
Executed: 2020-03-30
KIM, YOUNGBAE
Executed: 2020-03-30
PARK, JI-YONG
Executed: 2020-03-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Film Package and Method of Fabricating Package Module