Patent Assignment
Reel/Frame 052646/0732
Assignment of Assignor's Interest
Recorded: 2020-05-13
Pages: 6
Assignors
GUO, SHUAI
Executed: 2018-08-27
WANG, JIA WEN
Executed: 2018-08-27
DING, TAO TAO
Executed: 2018-08-27
XING, RUI YUAN
Executed: 2018-08-27
WANG, XIAO JIN
Executed: 2018-08-27
WANG, JIA YOU
Executed: 2018-08-27
LI, CHUN LONG
Executed: 2018-08-27
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
NO. 88 WEILAI 3RD ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Wafer Bonding Method and Structure Thereof