Patent Assignment
Reel/Frame 052664/0418
Assignment of Assignor's Interest
Recorded: 2020-05-14
Pages: 6
Assignors
PARK, JINWOO
Executed: 2020-03-17
PARK, JUNGHO
Executed: 2020-03-17
KIM, DAHYE
Executed: 2020-03-17
BAE, MINJUN
Executed: 2020-03-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level Package