Patent Assignment
Reel/Frame 052669/0466
Assignment of Assignor's Interest
Recorded: 2020-05-15
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package-On-Package (Pop) Type Semiconductor Packages