Patent Assignment
Reel/Frame 052673/0742
Assignment of Assignor's Interest
Recorded: 2020-05-15
Pages: 6
Assignors
YUN, INKUK
Executed: 2020-04-02
CHOI, YOUNHO
Executed: 2020-04-02
MOON, HONGKI
Executed: 2020-04-02
NA, HYOSEOK
Executed: 2020-04-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Heat-Dissipating Structure