Patent Assignment
Reel/Frame 052683/0758
Assignment of Assignor's Interest
Recorded: 2020-05-18
Pages: 3
Assignee
REALTEK SEMICONDUCTOR CORP.
NO.2, INNOVATION ROAD II, HSINCHU SCIENCE PARK,, HSINCHU, 300, TAIWAN
Covered Property
(1)
Chip Package Module Including Flip-Chip Ground Pads & Power Pads, and Wire-Bonding Ground Pads & Power Pads