Patent Assignment
Reel/Frame 052692/0205
Assignment of Assignor's Interest
Recorded: 2020-05-18
Pages: 6
Assignors
HEO, JUNYEONG
Executed: 2020-04-03
LEE, JAE-EUN
Executed: 2020-04-03
KO, YEONGKWON
Executed: 2020-04-06
WON, DONGHOON
Executed: 2020-04-03
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a First Semiconductor Stack and a Second Semiconductor Stack of Different Widths