Patent Assignment
Reel/Frame 052692/0452
Assignment of Assignor's Interest
Recorded: 2020-05-18
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Fillet Layer