IP Library › Assignment 052695/0852
Patent Assignment
Reel/Frame 052695/0852

Assignment of Assignor's Interest

Recorded: 2020-05-19 Pages: 3
Assignor
PARK, DAE KUEN
Executed: 2020-05-17
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Method for Fabricating an Electronic Module via Compression Molding
Application: 16/792,776 →
Publication: US 2020/0266121
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 19, 2020
From: FUERGUT, EDWARD
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 052695/0830 →
Assignment of Assignor's Interest Oct 13, 2021
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 057777/0049 →