Method for fabricating an electronic module via compression molding
An electronic module includes a semiconductor package having a die pad, a semiconductor die, and an encapsulant. The encapsulant has a first main face and a second main face opposite to the first main face. The die pad has a first main face and a second main face opposite to the first main face. The semiconductor die is disposed on the second main face of the die pad. An insulation layer is disposed on at least a portion of the first main face of the encapsulant and on the first main face of the die pad. The insulation layer is electrically insulating and thermally conducting. A heatsink is disposed on or in the insulation layer.
1. A method for fabricating an electronic module, the method comprising:
providing a semiconductor package comprising a die pad, a semiconductor die, and an encapsulant, the encapsulant comprising a first main face and a second main face opposite to the first main face, the die pad comprising a first main face and a second main face opposite to the first main face, the semiconductor being disposed on the second main face of the die pad; and
applying an insulation layer and a heatsink onto the first main face of the encapsulant and on the first main face of the die pad so that the heatsink is disposed on or in the insulation layer, the insulation layer being electrically insulating and thermally conducting,
wherein applying the insulation layer and the heatsink comprises:
dispensing a liquid material of the insulation layer onto the first main face of the encapsulant and onto the first main face of the die pad;
after the dispensing, placing the heatsink onto the liquid material to form an assembly;
placing the assembly in a compression molding apparatus;
pressing an upper mold tool of the compression molding apparatus downwards against both the liquid material and the heatsink;
after reaching an end position of the upper mold tool, curing and hardening the liquid material to form the insulation layer; and
after curing and hardening the liquid material, removing the assembly from the compression molding apparatus.
2. The method of claim 1 , wherein the insulation layer and the heatsink are applied such that the heatsink is embedded in the insulation layer and an outer surface of the heatsink is disposed slightly above an outer surface of the insulation layer.
3. The method of claim 1 , wherein two or more electronic modules are fabricated in parallel.
4. The method of claim 1 , wherein the liquid material is an epoxy resin.
5. The method of claim 4 , wherein the epoxy resin contains filler materials.
6. The method of claim 5 , wherein the filler materials comprise one or more of SiO2, Al2O3, AlN, Si3N4, BN, and diamond.
7. The method of claim 1 , wherein the upper mold tool a recessed portion which corresponds to a final shape and a final contour of the insulation layer and the heatsink to be fabricated.
8. The method of claim 7 , wherein in the end position, the recessed portion of the upper mold tool is completely filled by the liquid material and the heatsink.
9. The method of claim 1 , wherein curing the liquid material comprises applying heat to the liquid material.
10. The method of claim 1 , wherein the heatsink is a piece of copper.