Patent Assignment
Reel/Frame 052697/0513
Assignment of Assignor's Interest
Recorded: 2020-05-19
Pages: 6
Assignors
DING, SHAOFENG
Executed: 2020-04-30
AHN, JEONG HOON
Executed: 2020-04-30
CHOI, YUN KI
Executed: 2020-05-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same