Patent Assignment
Reel/Frame 052700/0939
Assignment of Assignor's Interest
Recorded: 2020-05-19
Pages: 7
Assignors
LEE, MIJI
Executed: 2020-02-17
JEONG, TAEYOUNG
Executed: 2020-02-17
JO, YOONKYEONG
Executed: 2020-02-17
PAE, SANGWOO
Executed: 2020-02-17
RHEE, HWASUNG
Executed: 2020-02-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including via and Wiring