Patent Assignment
Reel/Frame 052709/0142
Assignment of Assignor's Interest
Recorded: 2020-05-20
Pages: 3
Assignor
SUZUKI, KATSUHIKO
Executed: 2020-05-15
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Manufacturing Molded Chip