Patent Assignment
Reel/Frame 052719/0657
Assignment of Assignor's Interest
Recorded: 2020-05-20
Pages: 3
Assignors
ZENOU, MICHAEL
Executed: 2020-05-18
GILAN, ZIV
Executed: 2020-05-18
NESHER, GUY
Executed: 2020-05-18
Assignee
IO TECH GROUP LTD.
12B SHAFTESBURY CENTRE, 85 BARLBY ROAD, LONDON, W10 6AZ, UNITED KINGDOM
Covered Property
(1)
Method to Electrically Connect Chip with Top Connectors Using 3D Printing