Patent Assignment
Reel/Frame 052724/0229
Assignment of Assignor's Interest
Recorded: 2020-05-21
Pages: 2
Assignor
KUBO, KATSUYA
Executed: 2020-05-08
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Substrate Plating Method