Patent Assignment
Reel/Frame 052742/0079
Assignment of Assignor's Interest
Recorded: 2020-05-25
Pages: 8
Assignors
HUANG, XIN-HUA
Executed: 2020-03-27
YU, CHUNG-YI
Executed: 2020-04-23
LIN, YEONG-JYH
Executed: 2020-04-07
CHU, REI-LIN
Executed: 2020-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Trench Capacitor for Integrated Passive Devices