Patent Assignment
Reel/Frame 052744/0963
Assignment of Assignor's Interest
Recorded: 2020-05-26
Pages: 6
Assignors
DING, SHAOFENG
Executed: 2020-05-19
JANG, JAE JUNE
Executed: 2020-05-18
AHN, JEONG HOON
Executed: 2020-05-18
CHOI, YUN KI
Executed: 2020-05-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interposer Structure, Semiconductor Package Comprising the Same, and Method for Fabricating the Same