Patent Assignment
Reel/Frame 052754/0104
Assignment of Assignor's Interest
Recorded: 2020-05-26
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Sic Substrate Evaluation Method and Method for Manufacturing Sic Epitaxial Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.