IP Library Assignment 052758/0979
Patent Assignment
Reel/Frame 052758/0979

Assignment of Assignor's Interest

Recorded: 2020-05-27 Pages: 3
Assignors
FLEMMING, JEB H.
Executed: 2018-02-02
MCWETHY, KYLE
Executed: 2018-02-02
Assignee
3D GLASS SOLUTIONS, INC.
5601-B BALLOON FIESTA PARKWAY NE, ALBUQUERQUE, NEW MEXICO, 87113
Covered Property (1)
Impedence Matching Conductive Structure for High Efficiency RF Circuits
Application: 16/767,096 →
Publication: US 2020/0382089
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 28, 2022
From: 3D GLASS SOLUTIONS, INC.
To: SILICON VALLEY BANK
Reel/Frame 058815/0560 →