Patent Assignment
Reel/Frame 052762/0317
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 4
Assignors
CHU, MIN SIK
Executed: 2020-05-25
PARK, SEONG MI
Executed: 2020-05-25
JEONG, JIIN
Executed: 2020-05-25
KIM, JAE HOON
Executed: 2020-05-25
JOO, KYONG HEE
Executed: 2020-05-25
PARK, HO GEUN
Executed: 2020-05-25
LEE, BAEK YOUNG
Executed: 2020-05-25
Assignee
SAMSUNG SDS CO., LTD.
125, OLYMPIC-RO 35-GIL, SONGPA-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Detecting Defect Pattern on Wafer Based on Unsupervised Learning