Patent Assignment
Reel/Frame 052770/0082
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 10
Assignors
GONG, XUERUI
Executed: 2020-05-08
WANG, JIANGSHENG
Executed: 2020-05-08
YU, YONG
Executed: 2020-05-08
ZHANG, CHANG
Executed: 2020-05-08
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188 HEZUO RD., (WEST ZONE) HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Chip on Flex, Touch Assembly, and Display Device