Patent Assignment
Reel/Frame 052782/0092
Assignment of Assignor's Interest
Recorded: 2020-05-29
Pages: 4
Assignors
CHOU, CHIA-CHENG
Executed: 2020-04-21
KO, CHUNG-CHI
Executed: 2020-04-21
LEE, TZE-LIANG
Executed: 2020-04-21
LEE, MING-TSUNG
Executed: 2020-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Damascene Process Using Cap Layer