Patent Assignment
Reel/Frame 052784/0333
Assignment of Assignor's Interest
Recorded: 2020-05-29
Pages: 4
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Method for Manufacturing Three-Dimensional Shaped Object and Three-Dimensional Shaping Device