Patent Assignment
Reel/Frame 052789/0577
Assignment of Assignor's Interest
Recorded: 2020-05-29
Pages: 14
Assignors
DU, MENGMENG
Executed: 2020-05-06
DONG, XIANGDAN
Executed: 2020-05-06
MA, HONGWEI
Executed: 2020-05-06
YAN, JUN
Executed: 2020-05-06
CHENG, BO
Executed: 2020-05-06
LIU, BIAO
Executed: 2020-05-06
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188 HEZUO RD., (WEST ZONE),, HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Display Substrate Including Configuration of Insulation Layers Covering Contact Pads in Bonding Region, and Manufacturing Method Thereof