Patent Assignment
Reel/Frame 052792/0081
Assignment of Assignor's Interest
Recorded: 2020-05-29
Pages: 3
Assignors
LEE, YOONSUK
Executed: 2020-05-25
KWAG, DOYOUNG
Executed: 2020-05-25
PARK, SANGMOO
Executed: 2020-05-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Compression Bonding Apparatus