Patent Assignment
Reel/Frame 052798/0980
Assignment of Assignor's Interest
Recorded: 2020-06-01
Pages: 4
Assignor
KIM, MINSOO
Executed: 2020-04-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Dam Structure Surrounding Semiconductor Chip and Method of Manufacturing the Same