Patent Assignment
Reel/Frame 052800/0774
Assignment of Assignor's Interest
Recorded: 2020-06-01
Pages: 8
Assignors
FANG, JIANPING
Executed: 2020-05-29
LIAO, YANQIN
Executed: 2020-05-29
LONG, HAOHUI
Executed: 2020-05-29
SI, HUI
Executed: 2020-05-28
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Chip package structure having a package substrate disposed around a die