Patent Assignment
Reel/Frame 052805/0141
Assignment of Assignor's Interest
Recorded: 2020-06-01
Pages: 4
Assignors
SHEN, WEN-WEI
Executed: 2020-04-30
HUANG, SUNG-HUI
Executed: 2020-05-04
HOU, SHANG-YUN
Executed: 2020-05-05
HUANG, KUAN-YU
Executed: 2020-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof