Patent Assignment
Reel/Frame 052805/0212
Assignment of Assignor's Interest
Recorded: 2020-06-01
Pages: 4
Assignors
HO, MING-CHE
Executed: 2020-04-21
KUO, HUNG-JUI
Executed: 2020-04-21
LEE, TZUNG-HUI
Executed: 2020-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out (Info) Package Structure and Method