Patent Assignment
Reel/Frame 052815/0137
Assignment of Assignor's Interest
Recorded: 2020-06-02
Pages: 5
Assignors
KIM, YOUNGLYONG
Executed: 2020-04-27
CHUNG, MYUNGKEE
Executed: 2020-04-27
JANG, AENEE
Executed: 2020-04-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Improved Heat Dissipation