Patent Assignment
Reel/Frame 052815/0443
Assignment of Assignor's Interest
Recorded: 2020-06-02
Pages: 2
Assignors
LIN, JYH-NAN
Executed: 2020-05-21
WU, CHIA-YU
Executed: 2020-05-21
HSU, KAI-SHIUNG
Executed: 2020-05-21
LIU, DING-I
Executed: 2020-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Amorphous Layers for Reducing Copper Diffusion and Method Forming Same