IP Library › Assignment 052821/0537
Patent Assignment
Reel/Frame 052821/0537

Assignment of Assignor's Interest

Recorded: 2020-06-03 Pages: 5
Assignors
KIM, HAK GU
Executed: 2020-05-15
KANG, HO KYUNG
Executed: 2020-05-15
CHEON, SEONG JONG
Executed: 2020-05-15
HUR, YONG SIK
Executed: 2020-05-18
PARK, JIN SEON
Executed: 2020-05-15
LEE, YONG DUK
Executed: 2020-05-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property (1)
Chip Radio Frequency Package and Radio Frequency Module
Application: 16/891,265 →
Publication: US 2021/0242595
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Fourth Inventor's Name on the Cover Sheet Previously Recorded at Reel: 052821 Frame: 0537. Assignor(S) Hereby Confirms the Assignment. Sep 23, 2022
From: KIM, HAK GU; KANG, HO KYUNG; CHEON, SEONG JONG; HUR, YOUNG SIK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD
Reel/Frame 061983/0307 →