Patent Assignment
Reel/Frame 052842/0335
Assignment of Assignor's Interest
Recorded: 2020-06-04
Pages: 4
Assignor
YAN, MENG
Executed: 2020-04-16
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, 430000, CHINA
Covered Property
(1)
Hybrid Wafer Bonding Method and Structure Thereof