Patent Assignment
Reel/Frame 052843/0262
Assignment of Assignor's Interest
Recorded: 2020-06-04
Pages: 2
Assignor
CHOI, BOK KYU
Executed: 2020-05-21
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Stacked Sub-Packages with Interposing Bridges