Patent Assignment
Reel/Frame 052845/0429
Assignment of Assignor's Interest
Recorded: 2020-06-04
Pages: 4
Assignors
YEH, KUNG-CHEN
Executed: 2020-05-12
LU, SZU-WEI
Executed: 2020-05-12
TSAI, TSUNG-FU
Executed: 2020-05-12
SHIH, YING-CHING
Executed: 2020-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same