Patent Assignment
Reel/Frame 052869/0371
Assignment of Assignor's Interest
Recorded: 2020-06-08
Pages: 8
Assignors
QU, XIAOPENG
Executed: 2020-05-29
CHUN, HYUNSUK
Executed: 2020-06-07
WIRZ, BRANDON P.
Executed: 2020-06-01
BAYLESS, ANDREW
Executed: 2020-06-03
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods and Apparatus for Temperature Modification and Reduction of Contamination in Bonding Stacked Microelectronic Devices