Patent Assignment
Reel/Frame 052870/0725
Assignment of Assignor's Interest
Recorded: 2020-06-08
Pages: 6
Assignors
WU, WEI-CHENG
Executed: 2020-05-15
CHIU, CHIEN-CHIA
Executed: 2020-05-15
HSIEH, CHENG-HSIEN
Executed: 2020-05-15
HSU, LI-HAN
Executed: 2020-05-19
LEE, MENG-TSAN
Executed: 2020-05-15
LIN, TSUNG-SHU
Executed: 2020-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Including Shielding Plate in Redistribution Structure, Semiconductor Package Including Conductive via in Redistribution Structure, and Manufacturing Method Thereof