Patent Assignment
Reel/Frame 052881/0272
Assignment of Assignor's Interest
Recorded: 2020-06-09
Pages: 5
Assignors
LIN, SHIH TING
Executed: 2020-04-28
LU, SZU-WEI
Executed: 2020-04-28
CHEN, WEIMING CHRIS
Executed: 2020-04-28
TING, KUO-CHIANG
Executed: 2020-04-29
HOU, SHANG-YUN
Executed: 2020-04-28
WU, CHI-HSI
Executed: 2020-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method