Patent Assignment
Reel/Frame 052883/0713
Assignment of Assignor's Interest
Recorded: 2020-06-09
Pages: 6
Assignors
OH, EUNKYUL
Executed: 2020-04-23
CHO, YUNRAE
Executed: 2020-04-23
KIM, TAEHEON
Executed: 2020-04-23
HAN, SEUNGHUN
Executed: 2020-04-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same