Patent Assignment
Reel/Frame 052886/0639
Assignment of Assignor's Interest
Recorded: 2020-06-09
Pages: 4
Assignor
PARK, SAN-HA
Executed: 2020-06-05
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Die and a Method for Detecting an Edge Crack in a Semiconductor Die