Patent Assignment
Reel/Frame 052887/0269
Assignment of Assignor's Interest
Recorded: 2020-06-10
Pages: 4
Assignors
CHU, YUNG-CHI
Executed: 2020-05-29
KUO, HUNG-JUI
Executed: 2020-05-27
HU, YU-HSIANG
Executed: 2020-05-27
LIAO, SIH-HAO
Executed: 2020-05-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Composition for Sacrificial Film, Package, Manufacturing Method of Package