Patent Assignment
Reel/Frame 052890/0291
Assignment of Assignor's Interest
Recorded: 2020-06-10
Pages: 11
Assignors
HUANG, HSIN-YEN
Executed: 2020-05-28
TENG, CHI-LIN
Executed: 2020-05-28
CHEN, HAI-CHING
Executed: 2020-05-28
SHUE, SHAU-LIN
Executed: 2020-05-28
LEE, SHAO-KUAN
Executed: 2020-05-28
LEE, CHENG-CHIN
Executed: 2020-05-28
LO, TING-YA
Executed: 2020-05-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Dielectric Capping Structure Overlying a Conductive Structure to Increase Stability