Patent Assignment
Reel/Frame 052892/0549
Assignment of Assignor's Interest
Recorded: 2020-06-10
Pages: 2
Assignor
IWANO, TOMOHIRO
Executed: 2012-06-15
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Slurry, Polishing Liquid Set, Polishing Liquid, Method for Polishing Substrate, and Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Jun 11, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052920/0830 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →