Patent Assignment
Reel/Frame 052906/0138
Assignment of Assignor's Interest
Recorded: 2020-06-11
Pages: 11
Assignors
KAO, MIN-FENG
Executed: 2020-05-08
YAUNG, DUN-NIAN
Executed: 2020-05-21
LIN, HSING-CHIH
Executed: 2020-05-13
LIU, JEN-CHENG
Executed: 2020-05-13
CHU, YI-SHIN
Executed: 2020-05-21
CHEN, PING-TZU
Executed: 2020-05-08
CHEN, CHE-WEI
Executed: 2020-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices